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| Technology: |
- HDI Microvias
- Blind and Buried
Vias
- Hard Gold Plating
- Via In Pad
- Sequential Lamination
- Differential Impedance
- Hipot Test
- Press Fit Holes
- Heavy Copper
- Ultra Thin Core
- Ultra Fine Line
- Rigid-Flex
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| Advanced
Material: |
- Isola: PCL-370HR, IS420,
IS410, IS400
- Shengyi: S1000, S1000-2
- ITEQ: IT180A, IT150TC
- Kingboard: KB-6160, KB6167
- Teflon: Arlon, Taconic, Neltec
- Rogers: 4000 Series
- Aluminum Substrate: Bergquist,
ITEQ
- Halogen Free, High Tg/ Low
CTE, LDP, RCC
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| Manufacturing
Standard: |
- IPC-A-600G Class II
- IPC-A-600G Class III
- PERFAG 2E for Double-sided
Board
- PERFAG 3C for Multilayer
Board
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